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Boyd Laconia

374724B00032G-Boyd Laconia, LLC-HEATSINK BGA W/ADHESIVE TAPE

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Solid Metal Heat Sink for everyday users

The 374724B00032G-Boyd Laconia, LLC-HEATSINK BGA W/ADHESIVE TAPE by Boyd Laconia is a value-for-money solid metal heat sink designed for everyday users. It features Manufacturer: LLC, Boyd Laconia and Case/Package: BGA.

₹1,122
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Total: ₹1,122
Buying tip: A well-rounded choice at a fair price. Recommended for most buyers.
Estimated delivery: 17 Aug31 Aug
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Quick Specs

Manufacturer: LLC, Boyd Laconia
Case/Package: BGA
Mounting Type: Top Mount
Shape: Square, Pin Fins
Length (mm): 35.00
Width (mm): 35.00

Ideal For

Everyday convenience
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SKU: robu-2791599Category: Solid Metal Heat Sink

About This Product

The 374724B00032G-Boyd Laconia, LLC-HEATSINK BGA W/ADHESIVE TAPE by Boyd Laconia is a value-for-money solid metal heat sink designed for everyday users. It delivers reliable performance at an accessible price.

Key Specifications

  • Manufacturer: LLC, Boyd Laconia
  • Case/Package: BGA
  • Mounting Type: Top Mount
  • Shape: Square, Pin Fins
  • Length (mm): 35.00
  • Width (mm): 35.00
  • Fin Height(mm): 18.00
  • Material: Aluminum — built to last with a quality finish

Why Buy from Pricio?

Pricio sources this product directly, cutting out multiple middlemen. Every order includes free shipping, a 15-day return policy, and secure payment via Razorpay.

374724B00032G-Boyd Laconia, LLC-HEATSINK BGA W/ADHESIVE TAPE. Heatsink designed for efficient thermal management of ball grid array packages and other compact semiconductor devices. It is made from aluminum for lightweight yet effective heat dissipation and features a black anodized finish that improves heat radiation and provides surface protection Images for reference only.

Specifications: 

  1. Type: Top Mount
  2. Package Cooled: BGA
  3. Attachment Method: Thermal Tape, Adhesive (Included)
  4. Shape: Square, Pin Fins
  5. Length: 1.378" (35.00mm)
  6. Width: 1.378" (35.00mm)
  7. Fin Height: 0.709" (18.00mm)
  8. Power Dissipation @ Temperature Rise: 3.0W @ 50°C
  9. Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 200 LFM
  10. Thermal Resistance @ Natural: 15.30°C/W
For more detail refer to the datasheet in Attachments. 

Package Includes:

1 x 374724B00032G-Boyd Laconia, LLC-HEATSINK BGA W/ADHESIVE TAPE